重磅！格芯起诉台积电侵权了哪些专利？

北京时间8月27日早间消息，全球纯代工领域排名第二的美国芯片制造商Globalfoundries（格芯）公司今天在美国和德国提起了多个法律诉讼，指控台积电（TSMC）所使用的半导体生产技术侵犯了16项格芯专利。这些诉讼分别于今天向美国国际贸易委员会（ITC）、美国特拉华联邦地区法院、美国德克萨斯西区联邦地区法院，以及德国杜塞尔多夫地区法院和曼海姆地区法院提出。其中被告有20个！其中赫然有谷歌、思科、TCL、一加、联想等。

在提起法律诉讼的同时，格芯还申请了法院禁制令，以阻止总部位于中国台湾的、在半导体生产领域处于垄断地位的台积电使用侵权技术生产的产品被进口至美国和德国。考虑到台积电代工的客户包括苹果、高通、AMD、NVIDIA、赛灵思等美国重要厂商，一旦胜诉，台积电这些客户也会跟着受到影响。这些法律诉讼要求格芯指明台积电的主要客户以及下游电子公司，后者在大多数情况下才是包含了台积电侵权技术产品的实际进口人。格芯还基于台积电使用格芯专有技术而产生的数百亿美元的销售额而向台积电提出了巨额的损害赔偿请求。

“尽管半导体生产在持续地向亚洲转移，格芯却反其道而行之，在美国和欧洲的半导体行业进行了大量投资。在过去的十年中，格芯共在美国投资超过150亿美元，并在欧洲最大的半导体生产基地投资超过60亿美元。我们提起法律诉讼的目的在于保护这些投资，以及在背后驱动着这些投资的基于美国和欧洲的技术创新”，格芯的工程及技术副总裁Gregg Bartlett如是评价道。“多年来，在我们投入数十亿美元进行本土的技术研发的同时，台积电却在非法从我们的投资中获利。此次采取行动，对于叫停台积电对我们关键资产的非法使用，并保护美国和欧洲的生产基地十分重要。”

格芯希望通过提起法律诉讼来保护其投资、资产和知识产权，并藉此确保半导体行业始终是充满竞争的行业，以保护行业客户的利益。不过台积电发言人伊丽莎白·孙说，她的公司没有收到任何法庭文件，也不了解诉讼的细节。“台积电一直尊重知识产权，我们自主开发了所有技术，”她说。

那么 格芯起诉的16项侵权专利都是什么？这里做个全面曝光

GLOBALFOUNDRIESv. TSMC et al

Fact Sheet

原告 (2):

·GLOBALFOUNDRIES US Inc. (U.S.cases)

·GLOBALFOUNDRIES Dresden ModuleOne Limited Liability Company & Co. KG (German cases)

被告(20个):

·晶圆厂Taiwan Semiconductor Manufacturing Company Ltd.(TSMC)

·无晶圆设计企业：Apple, Broadcom, Mediatek, nVidia, Qualcomm, Xilinx

·电子分销商：Avnet/EBV, Digi-key, Mouser

·消费电子产品: Arista, ASUS, BLU, Cisco, Google, HiSense, Lenovo, Motorola, TCL, OnePlus

涉及的专利GF Patents in the cases(16):

Thetechnologies at issue relate to the advanced semiconductor devices and methodsof manufacturing those devices.

所涉及的技术涉及先进的半导体器件和制造这些器件的方法

See table on next page for details.

被侵权的技术Accused Infringing Technologies(5):

涉及工艺TSMC 7nm, 10nm, 12nm, 16nm ,28nm

起诉法院Courts/Tribunals (5)and Complaints (25)

·U.S. International TradeCommission (“ITC”) – 2 complaints (i.e. lawsuits)

·U.S. District Court for theDistrict of Delaware – 6 complaints

·U.S. District Court for theWestern District of Texas – 13 complaints

·Regional Court of Mannheim (“LandgerichtMannheim“) – 2 complaints

·Regional Court of Düsseldorf (“LandgerichtDüsseldorf”) – 2 complaints

下图是详细专利介绍

Complete List of Complaints to be Filed Monday August26

ITC #1

-Complaint againstTSMC, Mediatek, Qualcomm, Xilinx, Avent, Digi-key, Mouser, TCL, HiSense,Google, Motorola, BLU, OnePLus asserting ’603 Luning, ’418 Chudzik, and ’986Wei primarily directed to 7nm and 16nm

ITC #2

-Complaint againstTSMC, Apple, Broadcom, nVidia, Cisco, Arista, Lenovo, ASUS asserting ‘178 Kim,‘643 Kim, ‘357 Clark, and ‘877 Liang directed to 7nm, 10nm, 12nm, 16nm , 28nm

Western District of Texas(13)

Asserting the same patents asserted in the ITC

§Complaintagainst TSMC, MediaTek, Hisense on ’603 Luning, ’418 Chudzik, and ’986 Weiprimarily directed to 16nm

§Complaintagainst TSMC, Qualcomm, OnePlus on ’603 Luning primarily directed to 7nm

§Complaintagainst Avnet on ’603 Luning, ’418 Chudzik, and ’986 Wei primarily directed to16nm

§Complaint against Google on ’603 Luning and ’986 Wei primarilydirected to 16nm

§Complaintagainst TSMC, and Apple, ’178 Kim, ’643 Kim, ’357 Clark, and ’877 Liang,primarily directed to 7nm, 10nm, 16nm

§Complaintagainst TSMC, Broadcom, and Arista, ’178 Kim, ’643 Kim, ’357 Clark, and ’877Liang, primarily directed to 16nm

§Complaintagainst TSMC, NVIDIA, and Lenovo, ’178 Kim, ’643 Kim, ’357 Clark, and ’877Liang, primarily directed to 12nm

§Complaintagainst TSMC, NVIDIA, and Asus, ’178 Kim, ’643 Kim, ’357 Clark, and ’877 Liang,primarily directed to 16nm

§Complaintagainst TSMC and Cisco, ’178 Kim, ’643 Kim, ’357 Clark, and ’877 Liang,primarily directed to 16nm

Asserting different patents than thosepatents asserted in the ITC

§Complaint against TSMC, MediaTek, Hisense on ’348 Rashed, ’910 Rashed,’497 Chudzik, ’633 Tarabbia, ’167 You, ’966 Yang, primarily directed to 16nm

§Complaintagainst TSMC, Qualcomm, OnePlus on ’910 Rashed, primarily directed to 7nm

§Complaint against Avnet on ’348 Rashed, ’910 Rashed, ’497 Chudzik,’633 Tarabbia, ’167 You, ’966 Yang, primarily directed to 16nm

§Complaint against Google on ’348 Rashed, ’910 Rashed, ’633 Tarabbia, ’167You, ’966 Yang, primarily directed to 16nm

District of Delaware (6)

Asserting the same patents asserted in the ITC

§Complaintagainst Xilinx, Mouser on ’603 Luning, ’418 Chudzik, and ’986 Wei primarilydirected to 16nm

§Complaintagainst TCL on ’418 Chudzik primarily directed to 28nm

§Complaintagainst Motorola on ’603 Luning primarily directed to 7nm

Assertingdifferent patents than those patents asserted in the ITC

§Complaint against Xilinx, Mouser on ’348 Rashed, ’910 Rashed, ’497Chudzik, ’633 Tarabbia, ’167 You, ’966 Yang, ’491 Pham primarily directed to16nm

§Complaintagainst TCL on ’497 Chudzik primarily directed to 28nm

§Complaintagainst Motorola on ’910 Rashed, primarily directed to 7nm

Dusseldorf (2):

·Complaint against Apple Inc. on the 3 German patents

·Complaint against Qualcomm Inc. on the 3 German patents

Mannheim (2):

·Complaint against AppleRetail Germany BV & Co KG (runs the Apple stores in Germany) on the 3German patents

·Complaint against EBV ElectronicsGmbH & Co KG (Avnet subsidiary) on 2 German patents

根据据TrendForce旗下拓墣产业研究院最新报告统计，晶圆代工产业2019年第一季面临相当严峻的挑战，预估第一季全球晶圆代工总产值较2018年同期衰退约16％，达146．2亿美元。市占率排名前三名分别为台积电、三星与格芯，而尽管台积电市占率达48．1％，但第一季营收年成长率衰退近18％。

在全球晶圆代工市场上，台积电近年来一家独大，且7nm先进工艺几乎垄断了全球代工市场，GF在纯代工领域位居全球第二，与台积电营收差别较大，在这样的情况下，GF公司依然宣布要跟行业龙头公司打专利战，并将苹果、博通、NV等很多大牌列入被告，显然背后已经准备了很久，一旦胜诉，对产业影响非常大，我们将密切关注此案的进展。