导电银胶在FPD封装中如何防止水分侵蚀？

导电银胶在FPD（平板显示）封装中防止水分侵蚀的核心机制，源于其材料结构与工艺特性的协同作用，主要通过以下三方面实现高效防护：

一、致密固化层阻隔水汽渗透

导电银胶通过特殊配方设计，在固化后形成致密的物理屏障。例如，低温烧结银胶采用纳米级与微米级银粉复配体系，在150-200℃的低温烧结过程中，银颗粒间形成冶金结合，孔隙率极低，有效阻隔外部水汽侵入。而UV固化型导电银胶（如微晶科技WJ-2106A）在紫外光照射下快速交联成膜，固化收缩率小，膜层结构均匀致密，进一步减少水分渗透通道。这种高致密性是防止水分侵蚀的基础保障。

二、强界面粘结消除毛细通道

导电银胶需具备优异的粘结性能，确保与FPD基板（如玻璃、ITO膜）的紧密结合。其粘结性不仅依赖银粉与树脂基体的配比优化，还通过表面活性剂提升对基材的浸润性。当胶层与基板形成高强度结合时，可消除界面处的微缝隙，避免因毛细效应导致水分沿界面扩散。

Conductive silver paste needs to have excellent bonding performance to ensure a tight bond with FPD substrates such as glass and ITO film. Its adhesion not only depends on the optimization of the ratio of silver powder and resin matrix, but also enhances the wettability of the substrate through surfactants. When the adhesive layer forms a high-strength bond with the substrate, micro gaps at the interface can be eliminated, avoiding water diffusion along the interface due to capillary effects.

三、材料本征抗湿性与化学稳定性

导电银胶的树脂基体（如环氧树脂、丙烯酸酯）本身具有低吸湿率，且银粉作为导电填料化学性质稳定，不易与水分子发生反应。部分产品还添加疏水助剂，进一步降低材料表面能，使水分子难以附着渗透。同时，固化后的胶层具备高电阻稳定性，即使长期处于高湿环境，也不会因水分侵入导致导电性能劣化，保障FPD器件电学参数的可靠性。

The resin matrix of conductive silver paste (such as epoxy resin, acrylic ester) itself has low moisture absorption rate, and silver powder as a conductive filler has stable chemical properties and is not easily reacted with water molecules. Some products also add hydrophobic additives to further reduce the surface energy of the material, making it difficult for water molecules to adhere and penetrate. At the same time, the cured adhesive layer has high resistance stability, and even if it is exposed to high humidity for a long time, its conductivity will not deteriorate due to moisture intrusion, ensuring the reliability of the electrical parameters of FPD devices.

在FPD产线中，导电银胶的防潮性能直接关联面板良率。例如，OLED封装中若水分侵入有机发光层，会导致器件黑斑、寿命衰减等问题。采用上述防潮机制的导电银胶，可显著降低封装环节的失效率。当前本土企业已通过自主研发实现高性能导电银胶的国产化，其防潮性能与国际先进产品同步，为FPD制造提供了关键材料支撑。